semi合集-English.pdf - 第5618页
SEMI P10-0705 © SEMI 1990, 2005 113 8.1.7 AIM_FLUX_INTENSITY_DELTA — For aerial imaging metrology, the percentage dim ensional area variation between compara b le non-defective areas. Use d fo r contact and via defect me…
SEMI P10-0705 © SEMI 1990, 2005 112
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8 Terminology and Usage
8.1 Values in parentheses indicate the only acceptable alternative data values for the record and must be transmitted
exactly as shown. (x,y) indicates the acceptable data value must be an ordered pair of dimensions, coordinates,
repeat counts, filenames, or other parameters. (x,y,z) indicates an ordered triple. (x1,y1,z1) indicates a window with
two ordered pairs, (x1,y1) and (x2,y2), describing the lower left and upper right corners respectively. Records
without specified alternative values may have any appropriate data value.
8.1.1 ADDITIONAL_MASK_INFO — Any information necessary to specify the overall mask set which cannot be
specified elsewhere in the order structure; must be brought to the attention of mask vendor personnel.
8.1.2 ADDITIONAL_MASK_SET_INFO — Any information necessary to specify the overall mask set which
cannot be specified elsewhere in the order structure; must be brought to the attention of mask vendor personnel.
8.1.3 ADDITIONAL_MILESTONE_INFO — Text for the vendor to supply additional information regarding the
status of the mask.
8.1.4 ADDITIONAL_PATTERN_INFO — Any information necessary to specify the pattern(s) which cannot be
specified elsewhere in the order structure; must be brought to the attention of mask vendor personnel.
8.1.5 ADDITIONAL_RESULTS_INFO — Any information necessary to supply information to the customer which
cannot be specified elsewhere in the <mask_results> structure; must be brought to the attention of customer
personnel.
8.1.6 AIM_CD_DELTA — For aerial imaging metrology, the percentage CD width variation between comparable
non-defective features. Used for CD defect measurement across or between features. If this keyword appears as a
<mask_option>, then AIM_WAVELENGTH, WAFER_EXPOSURE_NUMERICAL_APERATURE,
WAFER_EXPOSURE_SIGMA APERATURE, and WAFER_EXPOSURE_ILLUMINATION must all also appear
under <mask_option>. Appearance of this keyword as a <mask_option> does not require aerial imaging metrology
for the mask, but merely sets the conditions under which it should be used if it its deemed necessary by the mask
maker, based on their negotiated agreements with the customer.
SEMI P10-0705 © SEMI 1990, 2005 113
8.1.7 AIM_FLUX_INTENSITY_DELTA — For aerial imaging metrology, the percentage dimensional area
variation between comparable non-defective areas. Used for contact and via defect measurement. If this keyword
appears as a <mask_option>, then AIM_WAVELENGTH, WAFER_EXPOSURE_NUMERICAL_APERATURE,
WAFER_EXPOSURE_SIGMA APERATURE, and WAFER_EXPOSURE_ILLUMINATION must all also appear
under <mask_option>. Appearance of this keyword as a <mask_option> does not require aerial imaging metrology
for the mask, but merely sets the conditions under which it should be used if it its deemed necessary by the mask
maker, based on their negotiated agreements with the customer.
8.1.8 AIM_INTENSITY_VARIATION_DELTA — For aerial imaging metrology, the percentage intensity
variation between comparable non-defective areas. Used for edge or isolated defect measurement. If this keyword
appears as a <mask_option>, then AIM_WAVELENGTH, WAFER_EXPOSURE_NUMERICAL_APERATURE,
WAFER_EXPOSURE_SIGMA APERATURE, and WAFER_EXPOSURE_ILLUMINATION must all also appear
under <mask_option>. Appearance of this keyword as a <mask_option> does not require aerial imaging metrology
for the mask, but merely sets the conditions under which it should be used if it its deemed necessary by the mask
maker, based on their negotiated agreements with the customer.
8.1.9 AIM_WAVELENGTH — Wavelength in nanometers to be used for <aerial_image_data> measurements This
keyword may appear in addition to PSM_WAVELENGTH for a single MASK_ID, though the values of the two
should usually be the same.
8.1.10 ALL_PATTERNS_APPROVAL_REQD — (T or F)
8.1.11 ALL_PATTERNS_APPROVED — (date) date approval was granted by customer
8.1.12 APPROVAL_REQD — If present, indicates that no mask(s) are to be written until the approval is explicitly
granted by the customer. The alphanumeric data field describes the items to be approved.
8.1.13 APPROVED — (T or F) date approval was granted by customer for APPROVAL_REQD.
8.1.14 ARRAY_CENTER — (x,y) Center of circular array limit, relative to the nominal center of the mask (chrome
side up).
8.1.15 ARRAY_DIAMETER — Diameter of circular array limit to be applied to pattern files.
8.1.16 ARRAY_DIAMETER_INCLUSIVE — (T or F) If T, then die which are at least partially included within
the circular array limit must be included in the array. If F, then only die which are wholly included within the
circular array limit may be included in the array.
8.1.17 ATTENUATOR — Attenuator Mask_Coating used for Embedded Attenuated Phase Shift Masks. (MoSi,
TinSin, ZrSi) or any other material agreed upon between customer/vendor. May be used in conjunction with other
Mask_Coatings.
8.1.18 AUTO_INSPECTION_REQD — (T or F) Automated inspection of the mask for defects is required.
8.1.19 BARCODE_LOCATION — (x,y) Location to place the center of the vendor-generated barcode, relative to
the nominal center of the mask (chrome side up).
8.1.20 BARCODE_ROTATION — (0, 90, 180, or 270) Degrees the barcode is to be rotated counterclockwise
(before mirroring).
8.1.21 BARCODE_TEXT — Text to be used by the vendor to build the barcode.
8.1.22 BARCODE_TYPE — (ASM, ASET, CANON, GCA, NIKON_STD or NIKON_CODE39, UT1X_10,
UT1X_24 and UT_XLS, and others on request) Encoding system to be used by the vendor to build the required
barcode.
8.1.23 BILLING_ADDRESS — Address for billing.
8.1.24 BILLING_CONTACT — Name of person to contact for billing purposes.
8.1.25 BILLING_EMAIL — Internet address for BILLING_CONTACT.
8.1.26 BILLING_FAX — Phone number for facsimile machine of BUSINESS_CONTACT.
8.1.27
BILLING_PHONE — Phone number for BILLING_CONTACT.
SEMI P10-0705 © SEMI 1990, 2005 114
8.1.28 BIN_SIZE — size of defect for SEVERITY_CRITERION_REQD sorting.
8.1.29 BLANK_BIREFRINGENCE_REQD — (number) The required degree to which the substrate used to make
the mask refracts an incident beam of unpolarized light into two separate beams of opposite polarization, expressed
as nanometers per centimeter (nm/cm).
8.1.30 BLANK_BIREFRINGENCE_USED — (number) The measured degree to which the substrate used to make
the mask refracts an incident beam of unpolarized light into two separate beams of opposite polarization, expressed
as nanometers per centimeter (nm/cm).
8.1.31 BLANK_DATE_OF_MFG — (date) The date of manufacture of the substrate used to make the mask as
supplied by the mask blank vendor.
8.1.32 BLANK FLATNESS — (0.25, 0.5, 1, 2, 5, 10, 20, or other numeric value) Flatness within quality area (see
SEMI P1).
8.1.33 BLANK_FLATNESS_USED — The flatness within the quality area of the mask blank used, as specified by
the mask blank supplier or as measured by the mask vendor.
8.1.34 BLANK_GRADE — (text) A designation of the relative defectivity of the substrate as specified by the mask
blank vendor.
8.1.35 BLANK_INDEX_OF_REFRACTION — (number) The ratio of the velocity of light of a given wavelength
in a vacuum to the velocity of light in the substrate used to make the mask.
8.1.36 BLANK_LENGTH — (number) The X-axis dimension of the substrate used to make the mask, as specified
by the mask blank vendor.
8.1.37 BLANK_LOT — (text) The mask blank vendor’s manufacture lot identification for the substrate used to
make the mask.
8.1.38 BLANK_SIZE — (2.5/60, 3/60, 3.5/60, 4/60, 4/90, 4/250, 5/60, 5/90, 5/250, 6/90, 6/120, 6/150, 6/250,
7/120, 7/150, 7/250, 7.25R/150 or 9/350) Nominal edge length (in inches) and thickness (in mils) of square
substrate; 7.25R/150 is a round substrate. (See SEMI P1.)
8.1.39 BLANK_THICKNESS — (number) The Z-axis dimension of the substrate used to make the mask, as
specified by the mask blank vendor.
8.1.40 BLANK_TYPE — (DFS, MFS, HTE, LTE, ULTE, WC, SL or EUV) Durable Fused Silica, Modified Fused
Slica, high-, low-, and ultralow thermal expansion glass (see SEMI P1.) WC and SL indicate White Crown and soda
lime glass. EUV is for Extreme Ultraviolet applications.
8.1.41 BLANK_VENDOR — (text) Standard vendor identification code for the mask blank vendor of the substrate
used to make the mask.
8.1.42 BLANK_WIDTH — (number) The Y-axis dimension of the substrate used to make the mask, as specified
by the mask blank vendor.
8.1.43 BLANKET_PO_NUMBER — Alphanumeric blanket purchase order number.
8.1.44 BOOLEAN — Logical operation to be performed on one or more following pattern files. Data value
meanings are:
NONE — no logical operation to be performed; sizing/scaling may still be performed,
OR — logical union of two files,
AND — logical intersection of two files,
NOT — logical inverse of one file,
XOR — logical union of two files, excluding all areas in which the two intersect, and
MINUS — logical difference between input file 1 and input file 2; i.e., logically removing from input file 1 the
portions of all digitized geometry which overlap with digitized geometry in input file 2.