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SEMI M23.4-0999 © SEMI 1999 1 SEMI M23.4-0999 SPECIFICATION FOR ROUND 100 mm POLISHED MONOCRYSTALLINE INDIUM PHOSPHIDE WAFERS FOR ELECTRONIC AND OPTOELECTRONIC DEVICE A PPLIC A TIONS (DOVE-TA I L TYPE) This specification…

SEMI M23.3-0600 © SEMI 1994, 20003

O. F.

I. F.

d = 5 mm

10 mm

O. F.

I. F.

d = 5 mm

15 mm

Figure A1-2

Rectangular Wafers Which can be Obtained from 50 and 75 mm Round Wafers

NOTICE: SEMI makes no warranties or representations as to the suitability of the standard set forth herein for any

particular application. The determination of the suitability of the standard is solely the responsibility of the user.

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literature respecting any materials mentioned herein. These standards are subject to change without notice.

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the risk of infringement of such rights, are entirely their own responsibility.

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SEMI M23.4-0999 © SEMI 19991

SEMI M23.4-0999

SPECIFICATION FOR ROUND 100 mm POLISHED

MONOCRYSTALLINE INDIUM PHOSPHIDE WAFERS FOR

ELECTRONIC AND OPTOELECTRONIC DEVICE APPLICATIONS

(DOVE-TAIL TYPE)

This specification was technically approved by the Global Compound Semiconductor Committee and is the

direct responsibility of the Japanese Compound Semiconductor Committee. Current edition approved by the

Japanese Regional Standards Committee on June 1, 1999. Initially available at www.semi.org August 1999;

to be published September 1999.

NOTE: The complete specification for this product includes all general requirements of SEMI M23.

Table 1 Dimension and Tolerance Requirements

Property Dimension Tolerance Units

DIAMETER (See NOTE 1.) 100.0 ± 0.5 mm

THICKNESS, CENTER POINT 625.0 ± 25 µm

PRIMARY FLAT LENGTH 32.5 ± 2 mm

SECONDARY FLAT LENGTH 18.0 ± 2 mm

NOTE 1: The diameter standard means that the dimension is centered to this value.

Table 2 Orientation and Flat Location Requirements

Property Requirement

OPTION Dove-Tail

PRIMARY FLAT ORIENTATION

) 1 1 (0 ± 0.5 (see Figure 1 in SEMI M23) under an indium facet. The primary

flat shall be perpendicular to the “Dove-Tail” etch figure (see NOTE 1).

SECONDARY FLAT ORIENTATION

) 1 1 0( 90°=± 5° clockwise from the primary flat.

SURFACE ORIENTATION

(100) ± 0.5°=(See Figure 1 in SEMI M23.)

(100) off 2° ± 0.5° toward the

0) 1 (1 plane (see NOTE 2).

(See Figure 2 in SEMI M23.)

ORTHOGONAL MISORIENTATION

± 5°=(See Figure 3 in SEMI M23.)

NOTE 1: Since there are various etchants, the appropriate etching method for revealing etch pits can be determined by each manufacturer. For

example, see reference “HBr-K

-H

O etching system for indium phosphide” J.L. Weyher et al., Materials Science and Engineering, B28

(1994) 488-492.

NOTE 2: The frame of reference is the (100) plane of the crystal. It is the wafer normal that is tilted toward the

0) 1 (1 plane of the crystal.

NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for

any particular application. The determination of the suitability of the standard is solely the responsibility of the user.